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The pads of the PCB are covered in solder paste, typically done with the help of a stencil
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The components are then carefully placed on the board, the paste helps in providing adhesion to hold the components in place
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The board is then placed inside the oven which controls the ambient temperature to follow a certain profile (specific to the solder paste used)
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During this process the components get soldered onto the board
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Solder Reflow Oven 2.0 - A homebrew solder reflow oven controller designed around an STM32L053 series MCU - PCB layouting done in Kicad
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1sand0s/Solder_Reflow_Oven_2.0
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Solder Reflow Oven 2.0 - A homebrew solder reflow oven controller designed around an STM32L053 series MCU - PCB layouting done in Kicad
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